regulated thermal boundary conductance between copper and diamond through nanoscale interfacial rough structures-凯发国际真人娱乐

凯发国际真人娱乐
regulated thermal boundary conductance between copper and diamond through nanoscale interfacial rough structures
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论文题目: regulated thermal boundary conductance between copper and diamond through nanoscale interfacial rough structures
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作者: ziyang wang, fangyuan sun,* zihan liu, libing zheng, dazheng wang, and yanhui feng*
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刊物名称: acs applied materials & interfaces
: 2023
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