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| 论文题目: | studies on the effects of soldering layer structures on tee module performance and thermal stress |
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| 作者: | dianru yu, zhihao yin, guanghui liu, hongyan xu, ju xu* |
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| 刊物名称: | 22nd international conference on electronic packaging technology (icept) |
| 年: | 2021 |
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studies on the effects of soldering layer structures on tee module performance and thermal stress