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| 论文题目: | microstructure and mechanical characteristics of a novel cu/cu3sn joint with cu/sn preform |
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| 作者: | ？ hongyan xu，wei zhang, xuan liu, ju xu* |
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| 刊物名称: | 22nd international conference on electronic packaging technology (icept) |
| 年: | 2021 |
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microstructure and mechanical characteristics of a novel cu/cu3sn joint with cu/sn preform